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Product Name | Flexible Circuits |
Type | 1-8 Layer |
Quality Grade | Standard IPC 2 |
Material | DuPont PI, Domestic Shengyi PI |
Board Size | Min 6mm*6mm, Max 400mm*500mm |
Board Thickness | 0.6mm - 2.0mm |
Copper Thickness | 0.5oz - 2.0oz |
Min Tracing / Spacing | 3mil |
Solder Mask Sides | As per the file |
Solder Mask Color | Green, White, Blue, Black, Red, Yellow |
Solder Stop Coating | PI and PET Film |
Silkscreen Sides | As per the file |
Silkscreen Color | White, Black, Yellow |
Surface Finishing | HASL, HASL Leadfree, Immersion Tin, Gold Finger, OSP |
Min Annular Ring | 4mil |
Min Hole Diameter | 8mil |
Tolerance Dimension | ±0.05mm |
Other Tech | Peelable Solder Mask, Stiffener |
Single Layer FPC Structure:
This kind of fpc is simple structure FPC.Usually made by Raw material and stick band copper clad laminates,those three raw materials are basic production material of fpc .
First the clad laminates need etching then get the circuit we want. The protective film need drill vias then get pads.
Then clean it up with rolling process to combine both together.
Then do the ENIG or HASL surface finishing to protect the pad. In this way fpc board will be made.
Usually need stamping exactly corresponding and form small printed circuit board.some fpc factory didn’t use use protection,this cost will be very low,but the circuit board strength will become bad. Except for the strength need low level,price need low ,better us paste protective film.
Double FPC Structure:
When the board circuits are very complex and single board can not reach functions needs,we need choose double fpc or multilayers fpc .The difference bewtween single layer fpc and mutilayer fpc are add via design series so that connect all layers clad copper.
Usually the first step to make vias. Drilling vias on the base material can clad copper are first step. And the next step is almost same to single layer fpc.
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